LONGi has launched Hi-MO X6 Max series at its Jiaxing factory, marking transition to rectangular silicon wafers.
With wafer size of 182.2×191.6mm and module size of 2382×1134mm, Hi-MO X6 Max series is designed specifically to meet the needs of distributed PV customers. Hi-MO X6 Max features innovative TaiRay Inside and HPBC cell technologies, achieving unprecedented stability, reliability and power generation efficiency.
The Hi-MO X6 Max series entered mass production in the current quarter, with a complete transition for all mainstream products expected by Q3 2024. This upgrade, projected to exceed 30GW, will ensure a continuous and stable supply to the market.
On July 7, 2023, LONGi and eight other companies agreed on new standard dimensions for rectangular silicon wafers and modules. Subsequently, on August 8, 2023, LONGi, along with five other companies, reached a consensus on the standardized dimensions for 72-cell rectangular silicon wafers (rectangular wafer size:182.2mm x191.6mm; rectangular wafer diagonal: 262.5mm).
LONGi’s TaiRay wafer and the breakthrough in mass-production of its self-developed HPBC technology has led to the creation of the new series, which integrates M11 dimensions (182.2mm×191.6mm) with TaiRay Inside and HPBC cell technologies.
According to Lv Yuan, head of the LONGi Product and Solution Centre, the standardized dimensions of Hi-MO X6 Max maximize customer benefits and reduce costs for engineering and material partners. The optimized dimensions also enhance container utilization during transportation, once again saving costs.
LONGi’s Hi-MO X6 Max can reduce transportation costs by $0.61/kW compared with the conventional Hi-MO X6 module, improving use of 40HC containers by 4.4 percent to achieve 98.5 percent container utilization.
Due to power enhancement, the BOS cost on the system installation side is also reduced by 3.57 percent (about $4.16/kW) when compared with the equivalent mainstream power grade (585W vs. 615W).
LONGi claims that customer revenue is also enhanced when compared to using 210R wafer based modules, Hi-MO X6 Max using M11 wafers with lower current, which can effectively reduce loss of current transmission cabling by 9 percent and increase power generation revenue by 0.1 percent.
GreentechLead.com News Desk