EnVerv, an innovative fabless semiconductor company
developing high performance Communications System on Chip (SoC) solutions for
the Smart Grid market announced that it has secured a $12M from Series B round
of funding led by Benchmark Capital.
“This investment will enable us to capitalize on our
technical achievements to scale customer support and volume production of our
high performance multimode PLC chips,”
said Shahin Hedayat, chief executive officer of EnVerv.
EnVerv is working on
highly integrated multi-standard (such as G3-PLC, PRIME, S-FSK and EnVerv’s
TurboPLC) narrowband PLC modems.
EnVerv’s PLC enables applications in Advanced Metering
Infrastructure (AMI), Solar Inverters, Active Lighting, Industrial Control
& Remote Monitoring markets where emphasis on mission critical
communications and reliable data transmission across power line networks are
EnVerv’s PLC technology has been field trialed worldwide
and has received customer acceptance in all major markets.
“Mission critical connectivity is the cornerstone of
building reliable smart grids worldwide and EnVerv’s SoC products provide the
best solution for smart grid communications,” said Bruce Dunlevie, general
partner at Benchmark Capital.
“Successful delivery on an array of high performance
Power Line Communications (PLC) SoCs in just over a year is a testament to
EnVerv’s laser focused execution and innovative product design. At Benchmark,
we look forward to working with EnVerv’s management to help continue with this
success.,” Dunlevie added.
By GreentechLead.com Team